优点: 电子陶瓷绝缘材料不导电, 即电阻率高, 绝缘强度高。对于一种 的绝缘陶瓷的性能要求, 主要是在电磁性能和机械性能两方面: 体积电阻率高, 相对介电系数小, 电磁性能损耗因子小, 介电强度高 ; 具有良好的导热性、耐腐蚀、不变形, 可以在很大的温度范围内使用; 机械加工性能膨胀系数接近半导体材料 。 Advantage : TM 's Electronic ceramic insulation is not conductive,, mainly in the magnetic properties and mechanical properties of two aspects: high volume resistivity, the relative dielectric coefficient is small, the electromagnetic performance dissipation factor is small,, corrosion resistance, no deformation, it can be used in a wide range of temperatures; Mechanical processing performance expansion coefficient is close to the semiconductor material. 应用: 电子陶瓷材料在电子设备中用作安装、固定、支撑、保护、绝缘、隔离及连接各种无线电元件及器件, 称为绝缘陶瓷或装置陶瓷。例如电路基板, 芯片封装外壳等, 电子陶瓷材料属于精细化工和电子材料的交叉领域。 Application : TM 's Electronic ceramic materials used in the electronic equipment, as fixed installation, support, protection, insulation, isolation and connect all kinds of radio components and devices, called ceramic insulating ceramics or devices  , Substrate, chip encapsulation shell, electronic ceramic material belongs to the cross field of fine chemicals and electronic materials. 功能: 耐高温高湿\ 绝缘\ 隔热\ 耐腐蚀\ 耐磨 Function :   high temperature and humidity resistance\ insulation \ thermal insulation \ anti-corrosion\ wear resistant 颜色: 乳白色 Colour :   ivory 成型工艺: 热压/ 干压/ 等静压/ 挤压 Forming process :  hot-pressing/ dry pressing/isostatic pressing/ extrusion Forming 理化指标: Physical and Chemical Index :

特性Property	Electric and electronic ceramic
氧化铝AL2O3(%)	94-99.7
体积密度bulk density (g/cm3) ≥	3.55-3.95
莫氏硬度Moh’s hardness	9
热膨胀系数coefficient of thermal expansion(m/m.K) (20-1000℃)	7-8×10-6
导热系数Thermal conductivity (w/m.k)	18-22
绝缘强度Insulating strength （KV/mm）	15-20
直流击穿强度DC breakdown strength   (Kv/mm)	17.6-20
吸水率Water absorption（%）<	0.08
断裂韧性fracture toughness  KΙC ≥	4.8MPa·m1/2
抗弯强度 flexure strength ≥	290MPa
常温耐压强度Ambient compressive strength（Mpa）≥	850
常温抗折强度Cold bending strength (Mpa) ≥	520
耐火度Refractoriness （℃）≥	2000
最高使用温度Max service temperature(℃) ≥	1650